Production procedures and equipment

We hereby illustrate the production phases of the printed circuits and the machinery which the Company uses, in order to continue to be professionally qualified on the market. The equipment has been purchased from leading companies. To view our equipment, and the technology used please click on the text.

Production procedure

• Technical office
• Drilling & Routing
• Multilayer
• Direct Metallization
• First Cu Plating Semipanel/Fullpanel
• Dry Film Lamination, Exposure, Development
• Electrolytic plating
• Dry Film Stripping Etching, Tin stripping
• Solder Resist Surfac Preparation
• Solder Application
• Solder Exposure
• Solder Development
• Solder Curing
• Hot Air Levelling / Hal Lead Free
• Screen-printing components graphite and peelable solder mask
• Mechanical Finishing
• Electrical test and final visual ispection

Laboratory

equipments

• 3 stations CAM Barco UCAM
  3 stations CAM Fabricam, Photoplotter Barco, Photoplotter EG, Optical test ACCU-Match2
• CNC drilling and milling : Giga5600, drilling Posalux 8 Teste, Posalux 4 Teste, North Star, Multilayer drilling INSPECTA
• BIEFFEBI Multilayer Vacuum Press
• Horizontal Direct Metallization:
  Desmering IS
  Atotech Neopac process
• Technology Semipanel and Fullpanel Telmec 
• Automatic Dry Film Laminator Hakuto
  2 Automatic Exposures Akuto
  Developing-machine IS
• Galvanic lines>
• Stripping, Etching and Stripping
• Solder Resist Surface preparation
• Electrospray Tok Tes-6000; Compact Line CL-DB CIBA
• Exposures
• Solder development: developing-machine IS
• Curing
• Hot Air Levelling Penta automatic & Penta 580 Lead Free
• Microcraft
• Scoring to numerical control Telmec 
• Milling CNC
• single and contemporary electrical tests Circuit Line, Flying Probe test Seica, Automatic testing F.A.T.
  

Laboratory